Zhu Shangzu shed more light on MediaTek Helio X30

MediaTek Helio X30 chipset is expected to hit the market sometimes next year, in an interview with Sun Chanhxu, MediaTek COO Zhu Shangzu shed more light on the Helio X30.

Zhu Shangzu voiced his assurance that X-series and P-series will significantly improve the consumer view of the MediaTek brand, he also confirmed that the Helio X30 will be manufactured by TSMC using 10nm manufacturing process.


The process will support 3 baseband carrier aggregation, Cat. 10-Cat. 12 network baseand, while the ARM Mali GPU will be replace with PowerVR GPU something MediaTek claims it’s more powerful and provides better performance, yet efficient on power consumption.

MediaTek Helio X30 will be second generation of deca-core processors which consist of dual-core 2.8GHz A73 next-gen architecture code-named Artemis, 4 x A53(2.2GHz) cores and 4 x A35 (2GHz) cores. The CPU will support four channels LPDDR4 RAM, up to 8GB RAM storage modules, and support for UFS 2.1 technical standards.

In other words, I doubt if we’ll see the any smartphone running MediaTek Helio X30 smartphone anytime soon, maybe sometimes next year.